- Adrijan Barić University of Zagreb Croatia
- Alexandre Boyer LAAS-CNRS France
- Andre Durier Continental France
- Bart Boesman Melexis Belgium
- Bernd Deutschmann Technical University of Graz Austria
- Bertrand Vrignon NXP France
- Binhong Li Institute of Microelectronics of Chinese Academy of Sciences China
- Bob Scully NASA Johnson Space Center USA
- Davide Pandini ST Microelectronics Italy
- Davy Pissoort KU Leuven Bruges Belgium
- Erica Raviola Politecnico di Torino Italy
- ErPing Li Zhejiang University China
- Etienne Sicard INSA Toulouse France
- Fabian Vargas PUCRS Brazil
- Franco Fiori Politecnico di Torino Italy
- Frank Klotz Infineon Germany
- Frederic Lafon Valeo France
- HarkByeong Park Samsung South Korea
- Hugo Pues Melexis Belgium
- Hyun Ho Park The University of Suwon South Korea
- Jack Kruppa Infineon Germany
- Jan Niehof NXP Netherlands
- Jean-Michel Redoute Universit y of Liege Belgium
- Jeremy Raoult Montpellier University France
- Jianfei Wu NUDT China
- Kieran O' Leary Mixed Signal Systems United Kingdom
- Kamel Abouda NXP France
- Makoto Nagata Kobe University Japan
- Mart Coenen EMCMCC Netherlands
- Masahiro Yamaguchi Tohoku University Japan
- Mauro Merlo ST Microelectronics Italy
- Mohamed Ramdani ESEO Angers France
- Mototsugu Okushima Renesas Japan
- Osami Wada Kyoto University Japan
- Ramiro Serra TU Eindhoven Netherlands
- Richard Xian-Ke Gao Institute of High Performance Computing A*STAR Singapore
- Renaud Gillon SYDELITY Belgium
- Richard Perdriau ESEO Angers France
- Seungyoung Ahn KAIST Korea
- Sergey Miropolsky Infineon Germany
- Shih-yi Yuan Feng Chia University Taiwan
- Sonia Ben Dhia LAAS-CNRS France
- Umberto Paoletti Hitachi Ltd. Japan
- Wolfgang Wilkening Bosch Germany
Last update Nov. 27, 2023 by E. Sicard